JPS4811348U - - Google Patents
Info
- Publication number
- JPS4811348U JPS4811348U JP5279771U JP5279771U JPS4811348U JP S4811348 U JPS4811348 U JP S4811348U JP 5279771 U JP5279771 U JP 5279771U JP 5279771 U JP5279771 U JP 5279771U JP S4811348 U JPS4811348 U JP S4811348U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5279771U JPS4811348U (en]) | 1971-06-18 | 1971-06-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5279771U JPS4811348U (en]) | 1971-06-18 | 1971-06-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4811348U true JPS4811348U (en]) | 1973-02-08 |
Family
ID=27934709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5279771U Pending JPS4811348U (en]) | 1971-06-18 | 1971-06-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4811348U (en]) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5458870A (en) * | 1977-10-18 | 1979-05-11 | Omron Tateisi Electronics Co | Method of molding mold of electronic device |
| JPS5825081U (ja) * | 1981-08-07 | 1983-02-17 | 富士通テン株式会社 | ハイブリッド集積回路を備える電子部品 |
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1971
- 1971-06-18 JP JP5279771U patent/JPS4811348U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5458870A (en) * | 1977-10-18 | 1979-05-11 | Omron Tateisi Electronics Co | Method of molding mold of electronic device |
| JPS5825081U (ja) * | 1981-08-07 | 1983-02-17 | 富士通テン株式会社 | ハイブリッド集積回路を備える電子部品 |